HIGH-STRENGTH CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED : To provide a circuit board using an Si3N4 ceramics that has a strong adhesion to a conductive layer and an insulating layer, for which warpage, burn-out, etc. are rarely occur, and manufacturing method of the board, especially a high bonding strength circuit board, etc. having monolayer or multilayer interconnection through concurrent sintering. SOLUTION : A board 1, which includes at least an insulating layer 2 and conductive layers 3 and 4, is characterised in that at least one layer of the total insulating layer has β-Si3N4 as the principal ingredient, is a sintered object that includes one or more elements selected from among a group composed of rare earth elements and alkaline earth elements, and at least one layer of the total conductive layer includes one or more elements selected from among those belonging to IVa, Va and VIa groups and one or more elements selected from the groups composed of rare earth elements and alkaline earth elements.