ARTICLE COMPRISING SILICON SUBSTRATE AND BOND LAYER

PROBLEM TO BE SOLVED : To provide a bond coat not injurious to the mechanical properties of a silicon substrate. SOLUTION : The bond layer for a silicon substrate contains a metal which forms a heat-resistant oxide having a thickness of about 0.1 to 20 μm. The metals which form the heat-resistant oxides include chromium, tantalum, niobium, silicon, platinum, hafnium, yttrium, aluminum, zirconium, titanium, a rare earth metal, an alkaline earth metal, and a mixture thereof.