Aluminum alloy sputtering target

Provided is an aluminum alloy sputtering target characterized by comprising a total amount of 0.01-0.04 at.% of one or more elements selected from the group consisting of Ni, Cr, Fe, Co, and Cu, a total amount of 0.01-0.06 at.% of one or more elements selected from rare-earth elements except for La, and the remaining portion being Al and unavoidable impurities.